Thermal analysis services
Power dissipation is an important issue in present-day PCB design.
Power dissipation will result in temperature difference and pose a
thermal problem to a chip. In addition to the issue of reliability,
excess heat will also negatively affect electrical performance and safety.
The working temperature of an IC should therefore be kept below the maximum
allowable limit of the worst case. In general, the temperatures of junction
and ambient are 125 °C and 55 °C, respectively.
The ever-shrinking chip size causes the heat to concentrate within a small
area and leads to high power density. Furthermore, denser transistors
gathering in a monolithic chip and higher operating frequency cause a
worsening of the power dissipation. Removing the heat effectively becomes
the critical issue to be resolved.
Our company can help you to solve potential thermal issues on your printed
circuit board. When working with you, our consultants can plan, manage and
execute a complete thermal analysis project for you, ensuring that you get
practical solutions within your schedule and budget.
- HyperLynx Thermal;
- Ansys IceBoard.
Please see some of our projects description:
PCB Design Samples.
For particular info you can post a question or request to the e-mail: