Nowadays designers are creating printed circuit boards with higher density, higher power and smaller than ever before. Thermal analysis is necessary to keep up with these advances. It must be performed in order to realize and solve potential problems in the design phase and avoid equipment failure due to thermal issues followed by costly redesign.
Main issues thermal analysis focuses on are as follows:
- identifying points of weakness in thermal and mechanical design (“hot spots”);
- looking for zones of stagnation (low cooling efficiency);
- identifying overstressed components (junction temperature exceeding established value).
So thermal analysis serves as an input to mechanical and electrical design improvements, reliability prediction and stress analyses. And Edality provides answers for the entire scope of thermal activities for all phases of the project.
Our thermal experts combine the deep knowledge of heat transfer and thermodynamics with sophisticated usage of the thermal analysis software. This combination ensures accuracy and innovation in the thermal management of the most complicated electronic projects.
Please see some of our projects description: