Intelligente beveiligings camera controller unit
The board is developed with complex 18-layer stack-up as well as HDI (high density interconect) technology usage (blind & buried micro-vias). The main purpose is high-speed data exchange. We performed the whole set of analysis (Signal integrity, Power integrity, Thermal analysis) to ensure the layout quality and to succeed with the first run of this product.
- identifying and tracking (following) objects;
- checking the (non)movement of objects against certain rules;
- signaling when certain conditions are met or violated.